External visual inspection
Exterior appearance inspection is the origin of the process of checking the number of parts, inner packaging, moisture indicators, drying and outer packaging, and then verifying secondary coatings, pin condition, sanding marks, foreign objects, manufacturer's logo placement and printed fonts (including date codes and country/region).
X Radiographic testing is a real-time non-destructive analysis used to inspect the hardware components inside a component. The main inspections are leadframes, wafer dimensions, gold wire binding maps, ESD damage and holes in the chip. Customers can provide available samples or pre-ordered leftovers for comparative inspection.
Electrical Characteristics Test
Use the semiconductor tube characteristics diagram to check if the chip is damaged by an open or short circuit test according to the device pinout and related instructions specified by the manufacturer in the data sheet.
Through professional failure analysis equipment and analysis methods, help customers analyze the causes of customer product failures, and give failure analysis reports and analysis conclusions。